Hiring Company: Flip chip underfill epoxy
Location: Guangdong,
Delaware
Job Type: Full Time
Salary: Not Specified
Experience Desired: 0 - 2 Years
Last Update: Oct 17, 2022 11:48:25 AM
Full Job Description:
DeepMaterial (Shenzhen) Co., Ltd. is an innovative company specializing in adhesives for semiconductor and electronic applications and surface protection materials for chip packaging and testing.
Based on the core technolo- gy of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhe-sives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing.
7th Floor, Building C, Comlong Science & Technology Park, Guanlan High-tech Park, Long- hua District, Shenzhen, Guangdong, China
13825524136
https://www.epoxyadhesiveglue.com/case-in-usa-american-partners-chip-underfill-solution/
Company Type: Direct Employer
Contact Name : Flip chip underfill epoxy
Contact Phone: 13825524136
Contact Email :
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