Hiring Company: BGA Package Underfill Epoxy
Location: Shenzhen,
California
Job Type: Part Time
Salary: Not Specified
Experience Desired: 0 - 2 Years
Last Update: Sep 05, 2022 03:02:23 AM
Full Job Description:
DeepMaterial (Shenzhen) Co., Ltd. is an innovative company specializing in adhesives for semiconductor and electronic applications and surface protection materials for chip packaging and testing.
Based on the core technolo- gy of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhe-sives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing.
Phone: +86-13825524136
7th Floor, Building C, Comlong Science & Technology Park, Guanlan High-tech Park, Long- hua District, Shenzhen, Guangdong, China
https://www.epoxyadhesiveglue.com/bga-package-underfill-epoxy/
Company Type: Direct Employer
Contact Name : BGA Package Underfill Epoxy
Contact Phone: 13825524136
Contact Email :
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