Hiring Company: BGA package underfill
Location: Shenzhen,
Illinois
Job Type: Full Time
Salary: Not Specified
Experience Desired: 0 - 2 Years
Last Update: Jul 20, 2022 02:35:12 PM
Full Job Description:
DeepMaterial (Shenzhen) Co., Ltd. is an innovative company specializing in industrial adhesives for semiconductor,home applicance and electronic applications and surface protection materials for chip packaging and testing. Based on the core technolo- gy of adhesives, DeepMaterial has developed industrial adhesives for chip packaging and testing, circuit board-level adhe- sives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing.
Address: 7th Floor, Building C, Comlong Science & Technology Park, Guanlan High-tech Park, Long- hua District, Shenzhen, Guangdong, China
Phone: (+86)-13825524136
Email: info@deepmaterialcn.com
Website: https://www.deepmaterialcn.com/bga-package-underfill.html
Company Type: Not Specified
Contact Name : BGA package underfill
Contact Phone: 13825524136
Contact Email :
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